| |
|
|
| |
|
|
| |
|
|
|
|
|
| |
|
|
|
|
|
| |
|
|
|
Latest Products |
|
| |
Support 99% IC Kinds!!
eMMC, UFS, and SPI Flash can support Dual Sockets and Dual Socket Sites Leads to
Double Efficiency
Up to 1000 UPH
Special for Tray and Tape
Economical Automation
Up to 3500 UPH
Super All-in-one Solution
Hybrid IC Programming System
Compact for Small
Office
Compatible IC Programming System
|
|
| |
|
|
|
DP2T Automated IC Programming System |
|
|
|
|
 |
DP2T is the most compact & cost-saving automated
programming system. It is able to embed with either one unit of the
universal programmer (ProgMaster-S8) to support SPI Flash, EEPROM, MCU,
and CPLD…etc. Or All-in-one Programmer (NuProgPlus) to support all
devices such as SPI Flash, EEPROM, MCU, CPLD, eMMC & UFS…etc.
DP2T also supports both input & output in Tray or Tape & Reel. With the
stable quality & high efficiency, the UPH can easily go up to 1000. Save
your budget & lower your labor cost starts from DP2T now. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
DP1000-G2 Automated IC Programming System |
|
|
|
|
|
|
|
 |
|
DP1000-G2, an automated programming system, is the
second generation of DP1000, which is extra lightweight and compact
compared to DP3000, as the size is 50% smaller! With the
ProgMaster Universal Programmer embedded in DP1000 and different
input/output peripherals, the system can provide an overall solution for
IC programming. Support all kinds of IC families, such as EEPROM, NAND/
NOR FLASH, and MCU…etc.
The system is embedded with 2 sets of ProgMaster-S8 programmer
providing 16 programming sites, which stabilizes the quality and the
high throughput. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
DP2000 Automated IC Programming System |
|
|
|
|
|
|
|
 |
|
DP2000 is an automated programming system
specially designed for tube/tape in & tape out. The system is equipped
with a moving programming module and 4 nozzles to handle pick &
placement of IC input, positioning, programming and IC output. With 4
nozzles functioning synchronously with the moving programming module,
DP2000 easily achieves high throughput, 3,000UPH. This unique and
creative design already obtained a patent. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
DP3000-G3 Automated IC Programming System |
|
|
|
|
|
|
|
 |
|
DP3000-G3 automated programming system is the third generation of DP3000. It is able to support CSP packages as well as small size packages, like 1.5 x 0.8mm size chips. DP3000-G3 supports different input/output peripherals, like tube, tape, and tray, to provides an overall solution for IC programming with more advanced features. DP3000-G3 supports all kinds of IC families, such as EEPROM, NAND/NOR FLASH, MCU, eMMC, and UFS...etc. It is able to expand up to 96 programming sites, which will keep the high throughput even when handling the high-density memory, like NAND Flash, eMMC, and UFS. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
DP600-A Automated Taping Machine |
|
|
|
|
|
|
|
 |
|
DP600-A is a new generation Automated taping
machine, which is designed to be simple and easy operated; tape width
adjustment can be finished within 10 seconds without any tool. DP600-A
supports devices packaged in 8~88mm width tape. With advanced
characteristics, DP600-A offers the best solution for the manufacturing
process. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
DP600-M2 Semi-Auto Taping Machine |
|
|
|
|
|
|
|
 |
|
DP600-M2 is a desktop semi-auto taping machine
that is able to work independently; designed to be simple and easy to
operate. It has both PSA (Press sensitive adhesive) and heat sealing
functions. Support 8~88mm tape width; able to finish adjustment within
10 seconds without any adjustment tool. With advanced characteristics,
DP600-M2 offers the best solution for the manufacturing process. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
DP900 Automated Repacking System |
|
|
|
|
|
|
|
 |
|
DP900 is a multi-functional packaging system that
integrates tube, tray and tape package equipment which allows
versatility and flexibility to meet different packing requirement. It is
designed to be fully automatic and each package equipment is modularized
as a sub-system for easy configuration and allows efficient work
turnaround time. In addition, DP900 supports JEDEC standard tray,
various SOP tubes and up to 22” tape reel, which is equipped with
different sensors to ensure packaging quality and prevent human or
system errors. Optional CCD camera can be added to the system for 2D
inspection and ink marker for IC marking. LCD keypad is available for
each sub-system to allow easier maintenance and troubleshooting. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
Auto Tray-250 Auto Tray Loader |
|
|
|
|
|
|
|
 |
|
Are you still changing the trays by yourself
whenever the tray is fully loaded? Auto Tray-250 is an automatic loader
specifically for tray input and output. It can accommodate up to 20 to
25 JEDEC standard trays at once and it can perfectly combine with
DediProg's automated IC programming systems, DP1000-G2 and DP3000-G2, or
other third party automation. Once the tray is filled up with IC, the
trays will exchange automatically, and it will only take about 25
seconds! |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
Auto Tray-350 Auto Tray Loader |
|
|
|
|
|
|
|
 |
|
Auto Tray-350 series is specifically for tray input and output, which
supports 20 to 25 JEDEC standard trays. The machine can perfectly
combine with DediProg's automated IC programming system and support
online ink or inkjet marking. Differ from the Auto Tray-250 is that Auto
Tray-350 can work independently as tray marker, and is able to save
eight setting files of tray condition for ink marking in the embedded
memory. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
Backup Boot Flash Modules |
|
|
|
|
|
Backup Boot Flash Module-DIP Socket |
|
|
|
|
|
|
|
 |
|
The Backup Boot Flash-DIP is an ingenious tool
created by DediProg to force the application controller to work
automatically on the backup SPI Flash inserted in our tool DIP socket
and no more on the Main Serial Flash soldered on board. At the
connection on board, the BBF tool will disable automatically the Main
Serial Flash that does not need to be unsoldered. The BBF-DIP
can be used as emulator by connecting it to the application DIP socket
(remove the DIP serial flash on the application) with our BBF cable
(included) and DIP cable adaptor. Or the BBF DIP can be used as a
programmer for serial flash in DIP packages if used together with SF100.
The Serial Flash can be easily changed manually thanks to the DIP
socket or even updated by connecting our SF100 programmer. The SF100
programmer is completely transparent for the application and will offer
to developer high flexibility for code trials or update.
Please note that the BBF modules only support 3.3V/2.5V IC. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
Backup Boot Flash Module-SO8N(150mil) socket |
|
|
|
|
|
|
|
 |
|
The Backup Boot Flash is an ingenious tool created
by DediProg to force the application controller to work automatically on
the backup SPI Flash inserted in our tool SO8N socket and no more on the
Main Serial Flash soldered on board. At the connection on board, the BBF
tool will disable automatically the Main Serial Flash that does not need
to be unsoldered. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
Backup Boot Flash Module-SO8W(207mil) socket |
|
|
|
|
|
|
|
%20socket.png) |
|
The Backup Boot Flash is an ingenious tool created
by DediProg to force the application controller to work automatically on
the backup SPI Flash inserted in our tool SO8W socket and no more on the
Main Serial Flash soldered on board. At the connection on board, the BBF
tool will disable automatically the Main Serial Flash that does not need
to be unsoldered. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
Backup Boot Flash Module-SO16W(300mil) Socket |
|
|
|
|
|
|
|
.png) |
|
The Backup Boot Flash is an ingenious tool created
by DediProg to force the application controller to work automatically on
the backup SPI Flash inserted in our tool SO16W socket and no more on
the Main Serial Flash soldered on board. At the connection on board, the
BBF tool will disable automatically the Main Serial Flash that does not
need to be unsoldered. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
Backup Boot Flash Module-Dual SO8W(207mil) Sockets |
|
|
|
|
|
|
|
%20Sockets.png) |
|
The Dual SO8W Backup Boot Flash is an ingenious
tool created by DediProg to force the application controller to work
automatically on the two backup SPI Flash inserted in our tool SO8W
sockets and no more on the two Main Serial Flash soldered on board. At
the connection, the BBF tool will disable automatically the two Main
Serial Flash that does not need to be unsoldered. The
BBF Dual SO8W tool allows working on two Backup Serial Flash providing
that they are controlled by the same SPI bus and two different Chip
select in the application board. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
Backup Boot Flash Module QUAD-8W Socket |
|
|
|
|
|
|
|
 |
|
The Backup Boot Flash QUAD (BBF-QUAD-8W) is an
ingenious tool created by DediProg to allow the application controller
to work on the backup SPI Flash inserted in our tool SO8W socket. It
allows the application controller to access the backup SPI Flash with
SPI single/Dual/Quad IO mode. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
Backup Boot Flash Kit |
|
|
|
|
|
BBF SO8W(207mil) Socket + SF100 Programmer |
|
|
|
|
|
|
|
 |
|
The Backup Boot Flash Kit (SO8W) is used as a
Serial Flash Emulator for easy code development to reduce your time to
market. Our Backup Boot Flash Module (included) can be connected to the
application by 3 different methods:
- On the Main Serial flash package soldered
on board by using our BBF Test Clip(SO8) (included).
- On our SMT 1.27mm Pin Header (included)
soldered in place of the Main Serial flash footprint for a better
stability by using the appropriate BBF cable (included).
- On your application 2.54mm (2X5) BBF
connector (if application designed with) by using the appropriate
BBF cable (included).
|
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
BBF SO16W(300mil) Socket + SF100 Programmer |
|
|
|
|
|
|
|
.png) |
|
The Backup Boot Flash Kit (SO16W) is used as a
Serial Flash Emulator for easy code development to reduce your time to
market. Our Backup Boot Flash Module (included) can be connected to the
application by 2 different methods:
- On the Main Serial flash package soldered
on board by using our SO16W Test Clip (included).
- On your application 2.54mm (2X5) BBF
connector (if application designed with) by using the appropriate
BBF cable (included).BF SO16W(300mil) Socket + SF100 Programmer
|
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
BBF Dual SO8W(207mil) Sockets + SF100 Programmer |
|
|
|
|
|
|
|
 |
|
The Backup Boot Flash Kit (Dual SO8W) is used as a
Serial Flash Emulator for easy code development to reduce your time to
market. Our Backup Boot Flash tool (included) can be connected to the
application by 3 different methods:
- On the Two Main Serial flash packages
soldered on board by using our Dedicated BBF Test Clip (included).
- On our Two SMT 1.27mm Pin Headers
(included) soldered in place of the Two Main Serial flash footprints
for a better stability by using the appropriate 2.54mm to 1.27mm
cable adaptor-dual header (included)
- On your application 2.54mm (2X5) BBF
connector (if application designed with) by using the appropriate
BBF cable (included).
|
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
BBF SO8N(150mil) Socket + SF100 Programmer |
|
|
|
|
|
|
|
|
The Backup Boot Flash Kit (SO8N) is used as a
Serial Flash Emulator for easy code development to reduce your time to
market. Our Backup Boot Flash Module (included) can be connected to the
application by 2 different methods:
On the Main Serial flash package soldered on board by using our SO8 Test
Clip (included).
On your application 2.54mm (2X5) BBF connector (if application designed
with) by using the appropriate BBF cable (included). |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
UFS IC Readers |
|
|
|
|
|
UFSProg-CS UFS IC Reader Board |
|
|
|
|
|
|
|
 |
|
UFSProg Series is a professional reader tool to
read and write data in each LUN of UFS IC. With a powerful bridge
controller IC, DP7000, UFSProg series can support UFS v2.1 up to Gear 3
speed and USB3.1 Gen1 with UASP high-performance protocol. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
SMT Sockets |
|
|
|
|
|
SPI Flash Socket 8 Pin-1 |
|
|
|
|
|
|
|
 |
|
This socket is designed for chips with SO8W 207
mil package. The socket can be soldered directly on the SO8W 207 mil PCB
foot print. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
SPI Flash Socket 16 Pin |
|
|
|
|
|
|
|
 |
|
The socket is designed for chips with SO16W 300
mil package. The socket can be soldered directly on the SO16W 300 mil
PCB foot print. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
SPI Flash Socket 8 Pin |
|
|
|
|
|
|
|
 |
|
This socket is designed for chips with SO8W 207
mil package. The socket can be soldered directly on the SO8W 207 mil PCB
foot print. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
Surface Mount TSOP56 Socket |
|
|
|
|
|
|
|
 |
|
Surface Mount TSOP56 socket is designed to be
soldered directly on TSOP56 PCB foot print. With this socket, engineers
no longer have to solder or desolder the TSOP56 chips during the
development phase. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
SPI Flash Socket WSON8 6*8 |
|
|
|
|
|
|
|
 |
|
The socket is designed for chips with WSON8 6*8 mm
package. The socket can be soldered directly on the WSON8 6*8 mm PCB
foot print. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
SPI Flash Socket 8 Pin-150mil |
|
|
|
|
|
|
|
 |
|
The socket is designed for chips with SO16W 300
mil package. The socket can be soldered directly on the SO16W 300 mil
PCB foot print. |
|
|
|
|
|
|
|
| |
|
|
|
|
|
